Fishing – trapping – and vermin destroying
Patent
1989-02-10
1990-10-09
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437228, 437245, 148DIG20, H01L 21283, H01L 2160
Patent
active
049620614
ABSTRACT:
A method for manufacturing a semiconductor integrated circuit device having a multilayer wiring structure. A semiconductor substrate on which a scribe line portion is to be formed is prepared to form an interlayer insulating film on the semiconductor substrate. Then, the interlayer insulating film at the scribe line portion is etched away so as to expose the scribe line portion on the semiconductor substrate. At this time, a step portion of the interlayer insulating film is formed at the scribe line portion. Then, a metal wiring film is formed on the whole surface of the semiconductor substrate comprising the step portion of this interlayer insulating film and etched away such that the residue of the metal wiring film may be left so as to cover this step portion along the step portion of the interlayer insulating film. By leaving the residue of the metal wiring film thickly and long along the step portion of the interlayer insulating film in this manner, the adhesion between the residue of the metal wiring film and the semiconductor substrate becomes strong and the residue of this metal wiring film is prevented from coming off in the manufacturing steps of a semiconductor integrated circuit device and from contaminating a wafer surface or manufacturing facilities.
REFERENCES:
patent: 4507853 (1985-04-01), McDavid
patent: 4666737 (1987-05-01), Gimpelson et al.
patent: 4711699 (1987-12-01), Amano
patent: 4807013 (1989-02-01), Manocha
patent: 4849069 (1989-07-01), Evans et al.
Chaudhuri Olik
Mitsubishi Denki & Kabushiki Kaisha
Quach T. N.
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