Fishing – trapping – and vermin destroying
Patent
1989-04-14
1990-10-09
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437228, 437182, 357 69, H01L 500
Patent
active
049620584
ABSTRACT:
A process of forming a multi-level semiconductor metallization structure from a single deposit layer of metal. The process provides the versatility of allowing stud-up, stud-down, thick and/or thin metallization structure lines to be formed from the single layer of metal. The thick metallization structure lines are low resistance lines, and the thin metallization lines are low capacitance lines. The separation of the thin metallization lines from the semiconductor substrate can be controlled further to decrease capacitive effects.
REFERENCES:
patent: 3801880 (1974-04-01), Harada et al.
patent: 3847690 (1974-11-01), Campbell, Jr. et al.
patent: 3890636 (1975-06-01), Harada et al.
Cronin John E.
Lee Pei-Ing P.
Hearn Brian E.
International Business Machines - Corporation
Nguyen Tuan
LandOfFree
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