Method for preparing a semiconductor substrate using porous sili

Fishing – trapping – and vermin destroying

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437 83, 437 84, 437 86, 437 62, H01L 2120

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054398436

ABSTRACT:
A semiconductor substrate comprises an insulating layer and a compound semiconductor monocrystal thin film formed on said insulating layer, the thermal expansion coefficient of said insulating layer being in the range of 60%-140% of that of said monocrystal thin film.

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