Printed circuit boards of laminated thermosetting sheets

Details Printed circuit boards of laminated thermosetting sheets Printed circuit boards of laminated thermosetting sheets

1985-01-25

1986-08-05

Nielsen, Earl

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428268, 428273, 428285, 428418, 523455, 525486, 528 93, C08K 525, C08L 6300

Patent

active

046043144

ABSTRACT:
Improved printed circuit boards of laminated thermosetting sheets with epoxy resin as the bonding agent contain for inhibiting copper migration 0.1% to 10% N,N'-bis-salicyloyl hydrazine, based on the weight of the hardened epoxy resin.

REFERENCES:
patent: 3849492 (1974-11-01), Brunetti et al.
patent: 3993622 (1976-11-01), Brunetti
J. P. Mitchell, T. L. Welsher, "Proceedings of the Printed Circuit World Convention II", vol. 1, Eugen G. Leuze Verlag, 1981.

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