Method and apparatus for obtaining reflow oven settings for sold

Metal fusion bonding – Process – With condition responsive – program – or timing control

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2282341, 395 23, B23K 100

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active

054391601

ABSTRACT:
An artificial neural network is trained to recognize inputted thermal and physical features of a printed circuit board, for providing settings for a reflow oven for obtaining acceptable soldering of the printed circuit board.

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Philip C. Kazmierowicz, "Thermal Profiling Reflow Solder", Circuits Assembly, Aug., 1992, pp. 59-62.
Casimir C. Kllmasauskas, "Applying Neural Networks, Part III: Training a Neural Network", PC AI, May/Jun. 1991, pp. 20, 22-24.
John Maxwell, "Temperature Profiles: The Key to Surface Mount Assembly Process Control", Surface Mount Technology, Jul., 1990, pp. 22-26.
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"Neural Computing", NeuralWare, Inc., Pittsburgh, Pa., 1991, pp. NC-i, NC-ii, NC-3, NC-7, NC-89-NC-109.
"The Reference Guide", NeuralWare, Inc., 1991, p. RF-5.
"User Interface Information", NeuralWare, Inc., 1991, pp. 1-2.
"NWorks Network Selector Table", NeuralWare, Inc., 1991, pp. 1-4.

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