Submount for semiconductor laser element

Details Submount for semiconductor laser element Submount for semiconductor laser element

1989-05-01

1990-08-07

Sikes, William L.

357 80, H01L 2348, H01L 3902

Patent

active

049472380

ABSTRACT:
A submount for a semiconductor laser element includes a substrate and a barrier layer disposed on opposed surfaces of the substrate and including a plurality of layers wherein the outermost layer of the barrier layers is Au and Ag. A metal alloy solder layer comprising Sn, Ag, and Sb is deposited on the barrier layers.

REFERENCES:
patent: 4170472 (1979-10-01), Olsen
patent: 4480261 (1984-10-01), Hattori et al.
Olsen et al., "Improved Cost Effectiveness and Product Reliability Through Solder Alloy Development", Solid State Technology, Sep. 1981, pp. 121-126.

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