Electronic part including a thin body of molding resin

Details Electronic part including a thin body of molding resin Electronic part including a thin body of molding resin

1995-06-06

1998-03-17

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174260, 174261, 257730, 257787, 257788, 257692, 257698, 361772, 361774, 361777, 361779, 437 68, 439219, 439209, H05K 702, H01L 2304

Patent

active

057294372

ABSTRACT:
A leadless package type electronic part, the cost and the size of which can be reduced and which exhibits excellent reliability, and an electronic part material for manufacturing the electronic parts. The electronic part of a leadless package type includes a rectangular substrate having a plurality of external electrodes in the periphery thereof, an element part placed on the surface of the substrate while being electrically connected to the external electrodes, and molding resin for molding the element part onto the surface of the substrate, wherein the surface of the molding resin is formed to be flat, and each side surface of the molding resin is flush, or aligned, with a respective side surface of the substrate.

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