Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-01-13
1998-03-17
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174250, 174252, 257707, 257713, 361715, 361717, H05K 720
Patent
active
057294356
ABSTRACT:
A semiconductor device includes a board base having through-holes filled with a filling core, and an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths. The semiconductor device further includes a semiconductor chip fixed on an upper surface of the additive layer, and nodes provided on a lower surface of the board base, wherein the one or more paths are laid out without a passage restriction posed by the through-holes, and are used for electrically connecting the semiconductor chip and the nodes.
REFERENCES:
patent: 4050756 (1977-09-01), Moore
patent: 4218701 (1980-08-01), Shirasaki et al.
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4483067 (1984-11-01), Parmentier
patent: 4783722 (1988-11-01), Osaki et al.
patent: 4922376 (1990-05-01), Pommer et al.
patent: 4954313 (1990-09-01), Lynch
patent: 5280413 (1994-01-01), Pai
patent: 5281151 (1994-01-01), Arima et al.
patent: 5311402 (1994-05-01), Kobayashi et al.
IBM Technical Disclosure Bulletin, vol. 27, No. 7B, Dec. 1984, New York, p. 4226, XP002010996 "silicon integrated hight performance package".
*Abstract*. vol. 008, No. 213 (E-269), 28 Sep. 1984. and JP-A-59 099752 (Toshiba KK), 8 Jun. 1984.
IBM Technical Disclosure Bulletin, vol. 36, No. 5, 1 May 1993, pp. 181-182, XP99940895 "Alternate Polymide/Metal Thin Film Packaging Structure".
*Abstract*. vol. 009, No. 295 (E-360), 21 Nov. 1985. and JP-A-60 134446 (Hitachi Seisakusho KK), 17 Jul. 1985.
WO-A-93 26142 (Mitsui Toatsu Chemicals) 23 Dec. 1993. *Abstract*.
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, "A Multilevel Epoxy Substrate for Flip-Chip Hybrid Multichip Module Applications" Vo. 15, No. 1, Feb. 1, 1992.
Patent Abstract of Japan, Publication No. JP4276631, vol. 17, No. 75 (E-1320), Feb.15, 1993.
IBM Technical Disclosure Bulletin, vol. 32, N. 8A, Jan. 1, 1990, pp. 178/179 LSI Packaging Design.
Hamano Toshio
Iijima Makoto
Minamizawa Masaharu
Mizukoshi Masataka
Takenaka Masashi
Fujitsu Limited
Thompson Gregory D.
LandOfFree
Semiconductor device and assembly board having through-holes fil does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and assembly board having through-holes fil, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and assembly board having through-holes fil will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-963680