Method of fabricating integrated semiconductor circuit

Details Method of fabricating integrated semiconductor circuit Method of fabricating integrated semiconductor circuit

1983-10-12

1986-08-05

Walton, Donald L.

Metal working

Method of mechanical manufacture

Assembling or joining

29574, 29576B, 2504922, 2504911, 2504923, 156643, H05K 306

Patent

active

046034730

ABSTRACT:
A method of fabricating an integrated semiconductor circuit device having a plurality of layers of circuit patterns, comprising forming the circuit pattern of at least one of the above mentioned layers by a direct exposure method using an electron beam, and forming the circuit pattern of at least one of the remaining layers by a light exposure method using a photomask.

REFERENCES:
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patent: 3875414 (1975-04-01), Prior
patent: 3876883 (1975-04-01), Broers et al.
patent: 4057347 (1977-11-01), Moriyama
patent: 4310743 (1982-01-01), Seliger
patent: 4322626 (1982-03-01), Kawashima
patent: 4370554 (1983-01-01), Bohlen et al.
patent: 4403151 (1983-09-01), Mochiji et al.
patent: 4442361 (1984-04-01), Zasio et al.
patent: 4443704 (1984-04-01), Yamashita et al.

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