Wire bonding inspecting apparatus with moving imaging area

Details Wire bonding inspecting apparatus with moving imaging area Wire bonding inspecting apparatus with moving imaging area

1991-10-11

1992-12-08

Nelms, David C.

Radiant energy

Photocells; circuits and apparatus

Optical or pre-photocell system

358101, G01N 2186

Patent

active

051700620

ABSTRACT:
A wire bonding inspecting apparatus for inspecting wires bonded between a semiconductor chip and leads comprises an imaging device for optically taking an image of the wire and converting the optical image into electric image signals; a moving device for moving the imaging device; an image processing inspecting unit for obtaining wire positional coordinates on the basis of image signals and inspecting the wire on the basis of the positional coordinates; and a main controller. When a whole wire does not lie within an image area of the imaging device, the moving device moves the imaging device; the imaging device takes plural optical wire images whenever moved and converts the optical images into image signals, respectively; and the image processing inspecting unit obtains the relative wire positional coordinates on the basis of the image signals whenever the optical images are taken and transforms the relative wire positional coordinates into the absolute wire positional coordinates for wire inspection, thus enabling a long wire to be inspected without adjusting the lens magnification, that is, under a constant high resolution.

REFERENCES:
patent: 4389669 (1983-06-01), Epstein et al.
patent: 4739175 (1988-04-01), Xamura
patent: 4872052 (1989-10-01), Liudzius et al.
patent: 4874956 (1989-10-01), Kato et al.
patent: 4942618 (1990-07-01), Sumi et al.
patent: 5113565 (1992-05-01), Cipolla et al.

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