Isolation trench in semiconductor substrate with nitrogen-contai

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive...

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437 64, 437 67, 437238, 438296, 438400, 438437, H01L 2176

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active

061566209

ABSTRACT:
An isolation trench in a silicon semiconductor substrate is provided with a barrier region containing nitrogen atoms formed in the trench, contiguous with the silicon semiconductor substrate surfaces of the trench. The novel isolation trench structure of the invention is formed by forming an isolation trench in a silicon semiconductor substrate; forming in the isolation trench a barrier region by treating the trench structure with nitrogen atoms from a nitrogen plasma; and then forming a silicon oxide layer over the barrier region in the trench to confine the nitrogen atoms in the barrier region. In a preferred embodiment, a silicon oxide liner is first formed over the silicon semiconductor substrate surfaces of the trench, and then the trench structure is treated with nitrogen atoms from a nitrogen plasma to form, on the silicon semiconductor substrate surfaces of the trench, a barrier layer which contains silicon atoms, oxygen atoms, and nitrogen atoms.

REFERENCES:
patent: 5702977 (1997-12-01), Jang et al.
patent: 5780346 (1998-07-01), Arghavani
Wolf, Stanley., Silicon Processing for the VLSI Era, 3 vols., (Sunset Beach, CA: Lattice Press, 1995), vol. 3: The Submicron Mosfet, pp. 224-225 .

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