Method of attaching solid state imaging device

Details Method of attaching solid state imaging device Method of attaching solid state imaging device

1999-03-01

2000-12-05

Nelms, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

257718, 257719, 361756, 361769, H01L 2144

Patent

active

061565873

ABSTRACT:
First, a CCD package is attached to a plane of a flexible substrate. A reference plane, which is parallel to an image forming plane of a solid state imaging device chip, is formed at the top of the CCD package. The reference plane is brought into contact with a reference plane of an optical unit, and a leaf spring presses the CCD package so that the CCD package can be fixed to the optical unit.

REFERENCES:
patent: 5920120 (1999-07-01), Webb et al.

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