Apparatus and method for flat circuit assembly

Details Apparatus and method for flat circuit assembly Apparatus and method for flat circuit assembly

1996-07-03

1998-03-17

Monin, Donald

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257532, 257924, H01L 2702

Patent

active

057290539

ABSTRACT:
A thin and flat integrated circuit assembly (10, 40) may be achieved by using a thin carrier (20) with shallow cavities (22, 24) for holding the integrated circuits (16) and/or discrete circuit components (14). The integrated circuits (16) and/or circuit components (14) may be friction fitted in the cavities (22, 24) or they may be secured therein by the use of adhesives and/or solder. Electrical connection between the integrated circuits (16) and circuit components (14) may be done with wire bonding, ribbon bonding, tape-automated bonding, lead frames, flip chip bonding, and/or conductive gluing of leads. The circuit assembly may then be accommodated into a credit card-sized packaging with standard dimensions set by the International Standards Organization.

REFERENCES:
patent: 4577214 (1986-03-01), Schaper
patent: 4907062 (1990-03-01), Fukushima
patent: 5440171 (1995-08-01), Miyano et al.
patent: 5608261 (1997-03-01), Bhattacharyya

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