Post-termination apparatus and process for thick film resistors

Details Post-termination apparatus and process for thick film resistors Post-termination apparatus and process for thick film resistors

1988-10-11

1992-12-08

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427102, 427103, C23C 2600

Patent

active

051696797

ABSTRACT:
A printed circuit board includes both high and low resistive value thick film resistors interconnected by a copper film. To lower the contact resistance to the thick film resistors of high value, each is provided at its ends with a termination of a composition similar to that used for the low value resistors. This provides a relatively low resistance contact region which overcomes the difficulty that a copper thick film conductor has in making electrical connections to compositions generally used for making high value thick film resistors. The composition of high and low resistivities are adapted to permit firing of both compositions in a single firing step.

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Solid State Technology, vol. 24, No. 1, Washington US, pp. 73-79; Stein et al; "Basic Metal Thick Film Conductors".

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