Semiconductor wafer wax mounting and thinning process

Details Semiconductor wafer wax mounting and thinning process Semiconductor wafer wax mounting and thinning process

1992-06-01

1993-10-26

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437231, 437248, 437946, 511315, 51277, H01L 21302, H01L 21463

Patent

active

052565998

ABSTRACT:
A wax (13) dissolved in solvent is placed on a semiconductor wafer (12) and made uniform. An assembly is formed by bonding the semiconductor wafer (12) to a submount (17) with a uniform wax layer (14). The submount (17) supports and allows handling of the semiconductor wafer (12) during wafer process steps. The assembly is heated in a vacuum to remove solvent and air trapped in the uniform wax layer (14) thereby minimizing air voids which can cause a non-uniform bond. The assembly is then annealed to reduce stress on the semiconductor wafer (12) induced by differing material thermal expansion rates of the semiconductor wafer (12), the uniform wax layer (14), and the submount (17).

REFERENCES:
patent: 3970494 (1976-07-01), Pritchard
patent: 3979239 (1976-09-01), Walsh
patent: 4316757 (1982-02-01), Walsh
patent: 4512113 (1985-04-01), Budinger

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