Shrink accommodating lead frame

Details Shrink accommodating lead frame Shrink accommodating lead frame

1992-04-15

1993-10-26

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437206, 437207, 437214, 437217, H01L 2160

Patent

active

052565980

ABSTRACT:
A lead frame design which can be used with a number of different die sizes is described. To customize the lead frame, a punch excises an amount of lead finger material to form a void between the lead fingers for receiving a die. The amount of material removed is greater for larger sized die. A material, such as an adhesive tape, attaches the die to the lead frame. The bond pads on the die are then wire bonded to the lead fingers. The adhesive tape also locks the lead fingers into place, thereby preventing movement which could detach the bond wires from the die or lead frame.

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patent: 5086018 (1992-02-01), Conru et al.

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