1999-02-04
2000-12-05
Ip, Sikyin
Metal treatment
Stock
148442, 420557, 420561, 420562, 420577, 420589, B23K 3522
Patent
active
061561320
ABSTRACT:
Lead-free alloys of the present invention includes bismuth in the amount of 30 to 58% by weight and one of the following first to fourth compositions in addition to tin as a main component. In the first composition, germanium is present in the amount of 0.1 or less % by weight. In the second composition, silver is present in the amount of 5% by weight or less and antimony is present in the amount of 5% by weight or less in addition to 0.1% by weight or less of germanium of silver. In the third composition, nickel and copper are included, preferably 0.2 or less % by weight or less of nickel and 1% by weight of copper. In the fourth composition, at least one selected from the group of 5 or less % by weight of silver, 5 or less % by weight of antimony, and 0.1 or less % by weight of germanium in addition to 0.2 or less % by weight of nickel and 1 or less % by weight of copper. Accordingly, the solder alloys of the present invention can be provided as lead-free and low-fusing solder alloys having good ductility, heat resistance, and wettability, compared with the conventional one.
Shiokawa Kunio
Tada Shinji
Yamashita Mitsuo
Frank Robert J.
Fuji Electric & Co., Ltd.
Ip Sikyin
LandOfFree
Solder alloys does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solder alloys, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder alloys will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-957627