Method for reducing or avoiding the formation of a silicon reces

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

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134 3, 134 254, 134 26, 134 28, 134 29, 134 34, 134 36, 134 41, 134 42, 134902, 438748, 438753, 510175, B08B 304

Patent

active

061561266

ABSTRACT:
A method for cleaning a silicon wafer. The method includes intentionally exposing the wafer into a volatile solvent with a polarity between about 2 and 4, whereby the wafer is cleaned by the solvent such that the formation of silicon recesses in source/drain extension regions on the silicon wafer can be prevented or avoided.

REFERENCES:
patent: 5358809 (1994-10-01), Van Berkel
patent: 6025274 (2000-02-01), Lin et al.

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