Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-07-07
1994-08-16
Flanigan, Allen J.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 803, 361719, 174 163, H01L 2336
Patent
active
053392159
ABSTRACT:
A heat sink mounted on a semiconductor chip module sealed hermetically with a cap. The heat sink includes an absorption portion for absorbing the heat generated by a semiconductor chip. The absorption portion is inserted into an opening formed in a cap to contact a semiconductor chip sealed hermetically within the cap. The heat sink further includes a heat dissipation portion exposed outside the cap for dissipating the heat of the semiconductor chip absorbed by the absorption portion.
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Flanigan Allen J.
Sumitomo Electric Industries Ltd.
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