Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-09-22
1999-06-01
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257703, 257705, 257738, 257693, H01L 2334, H01L 2348, H01L 2329
Patent
active
059090588
ABSTRACT:
A thin type semiconductor package having a low thermal resistance and a low electric resistance is disclosed, that comprises a nitride ceramic supporting substrate having a first main surface and a second main surface, the nitride ceramic supporting substrate having via-holes that pass through from the first main surface to the second main surface, a resin film having a wiring layer, the resin film being bonded to the first main surface of the supporting substrate, the wiring layer being electrically connected to an edge portion of the via-holes on the first main surface, the resin film having an opening region, a semiconductor chip directly mounted on the first main surface of the nitride ceramic supporting substrate, disposed at the opening region of the resin film, and electrically connected to the wiring layer of the resin film, and external connection terminals disposed on the edge portion of the via-holes of the second main surface.
REFERENCES:
patent: 5063121 (1991-11-01), Sato et al.
patent: 5126824 (1992-06-01), Ueda
patent: 5229213 (1993-07-01), Horiuchi et al.
patent: 5541145 (1996-07-01), Harris et al.
patent: 5698896 (1997-12-01), Komatsu et al.
patent: 5729051 (1998-03-01), Nakamura
patent: 5763939 (1998-06-01), Yamashita
H. Okoshi et al., "New BGA Package with AIN Heat-Spreader", International Microelectronics Conference Proceedings, pp. 24-27, Apr. (1996).
Asai Hironori
Iwase Nobuo
Koiwa Kaoru
Yano Keiichi
Clark Jhihan B.
Kabushiki Kaisha Toshiba
Saadat Mahshid
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