Thermally coupled pressure swing adsorption

Chemistry of inorganic compounds – Modifying or removing component of normally gaseous mixture – Carbon dioxide or hydrogen sulfide component

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95 99, 95100, 95103, 96115, 96125, 96128, 96130, 423220, B01D 5304

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active

052561720

ABSTRACT:
Pressure swing adsorption separation of a gas mixture is performed in an apparatus with a plurality of adsorbent beds cooperating to exchange energy from an adsorbent bed undergoing a depressurization step to an adsorbent bed undergoing a pressurization step, and with provision for thermal coupling in order to improve process efficiency. Thermal coupling is provided as heating to augment expansion energy recovery, and as a temperature gradient imposed in adsorbent beds to provide the function of a thermal regenerator in a regenerative thermodynamic cycle. The invention provides improved techniques for recovery of expansion energy in pressure swing adsorption, and for direct application of thermal energy to power pressure swing adsorption processes.

REFERENCES:
patent: 3221476 (1965-12-01), Meyer
patent: 4312851 (1982-01-01), Isalski et al.
patent: 4392871 (1983-07-01), Almlof et al.
patent: 4614525 (1986-09-01), Reiss
patent: 4671893 (1987-06-01), Pinto
patent: 4695442 (1987-09-01), Pinto et al.
patent: 4702903 (1987-10-01), Keefer
patent: 4732579 (1988-03-01), Veltman et al.
patent: 4793832 (1988-12-01), Veltman et al.
patent: 4801308 (1989-01-01), Keefer
patent: 4816121 (1989-03-01), Keefer
patent: 4915711 (1990-04-01), Kumar
patent: 4954146 (1990-09-01), Garrett et al.
patent: 4968329 (1990-11-01), Keefer
patent: 5015272 (1991-05-01), Okada et al.
patent: 5082473 (1992-01-01), Keefer
patent: 5096469 (1992-03-01), Keefer
patent: 5104426 (1992-04-01), Yamada et al.
patent: 5112590 (1992-05-01), Krishnamurthy et al.
patent: 5133785 (1992-07-01), Kumar et al.
patent: 5152812 (1992-10-01), Kovach

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