Method of making plated through hole printed circuit board

Details Method of making plated through hole printed circuit board Method of making plated through hole printed circuit board

1975-09-18

1977-04-19

Duzan, James R.

Metal working

Method of mechanical manufacture

Electrical device making

29626, 29628, 174 685, 427 96, 427 97, B41M 308

Patent

active

040179680

ABSTRACT:
A circuit board having through hole connections between circuit elements on opposite sides of the board. Each through hole has its end portions countersunk, with peripheral portions of the circuit element depressed into the countersink area. A layer of conductive material is plated in the wall of each hole, with the conductive material overlapping the circuit element material that is depressed into the countersink.
In the method of the present invention, a resist coating is applied uniformly over both planar surfaces of a circuit board on which the circuit elements have already been formed. The portions of the circuit elements contacting the edge portions of the through holes in the board are mechanically depressed into the substrate to form the countersink areas. Thereafter a coating is applied, either by an electroless process or electrolytically to form the plated through hole connection.

REFERENCES:
patent: 2716268 (1955-08-01), Steigerwalt
patent: 2958120 (1960-11-01), Taylor
patent: 3354543 (1967-11-01), Lawrence et al.
patent: 3436513 (1969-04-01), Harris
patent: 3654097 (1972-04-01), Degnan
patent: 3702284 (1972-11-01), Merkenschlager
patent: 3873429 (1975-03-01), Brown
Coombs, Printed Circuits Handbook, McGraw-Hill, 1967, pp. 4-19, 5-10.

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