Multi-layer film substrate and process for production thereof

Details Multi-layer film substrate and process for production thereof Multi-layer film substrate and process for production thereof

1995-06-05

1999-06-01

Stemmer, Daniel

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

428331, 428355R, C09J 1104

Patent

active

059085290

ABSTRACT:
A multi-layer film substrate comprising at least two laminated insulating layers composed of a polyimide having a low thermal expansion, wherein an adhesion layer composed of an Si-containing or SiO.sub.2 -dispersed polyimide is interposed between the low thermal expansion polyimide layers. The substrate is produced by laminating at least two insulating layers composed of a polyimide having a low thermal expansion, wherein the low thermal expansion polyimide layers are laminated through an adhesion layer composed of an Si-containing or SiO.sub.2 -dispersed polyimide.

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