Polishing system for polishing wafer

Details Polishing system for polishing wafer Polishing system for polishing wafer

1997-04-11

1999-06-01

Morgan, Eileen P.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 8, 451 41, 451285, 451287, 451289, B24B 4900

Patent

active

059083476

ABSTRACT:
In the polishing system of the present invention, a adhering unit adheres a wafer on a carrying plate using liquid. A polishing unit polishes the wafer using a polishing plate. A feeding unit conveys the carrying plate from the adhering unit to the polishing unit. A dismounting unit removes the wafer from the carrying plate. A first discharging unit conveys the carrying plate from the polishing unit to the dismounting unit. A cleaning unit cleans the vacant carrying plate. A second discharging unit conveys the carrying plate from the dismounting unit to the cleaning unit. A third discharging unit conveys the carrying plate from the cleaning unit to the adhering unit. The units are formed into a loop lines so that the carrying plate is circulated in the loop line and the wafers are polished therein.

REFERENCES:
patent: 4653231 (1987-03-01), Cronkhite et al.
patent: 4680893 (1987-07-01), Cronkhite et al.
patent: 4960485 (1990-10-01), Ichinose et al.
patent: 5605487 (1997-02-01), Hileman et al.
patent: 5616063 (1997-04-01), Okumura et al.
patent: 5653622 (1997-08-01), Drill et al.
patent: 5679060 (1997-10-01), Leonard et al.

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