Printed circuits and base materials precatalyzed for metal depos

Details Printed circuits and base materials precatalyzed for metal depos Printed circuits and base materials precatalyzed for metal depos

1992-11-20

1994-08-16

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 97, C23C 2600

Patent

active

053385675

ABSTRACT:
This invention concerns a method of manufacturing printed wiring boards by electrolessly plating copper on a precatalyzed base material which contains a polymeric resin, woven glass cloth reinforcement and a noble metal catalyst on clay support to precatalyze the base material for electrolessly depositing copper. The improvement comprises providing in the polymeric resin, a phenolic resin component and a silicate filler. The silicate filler is present in an amount between 30 and 100 part per hundred parts of the polymeric resin, and in an amount sufficient to provide a take time for the initiation of electroless copper deposition at least two times faster than a comparable precatalyzed base material without the silicate filler and phenolic resin.

REFERENCES:
patent: 3226256 (1965-12-01), Schneble
patent: 3546009 (1970-12-01), Schneble, Jr. et al.
patent: 3560257 (1971-02-01), Schneble, Jr. et al.
patent: 3600330 (1971-08-01), Schneble, Jr. et al.
patent: 3620933 (1971-11-01), Grunwald
patent: 3628999 (1971-12-01), Schneble
patent: 3629185 (1971-12-01), Schneble, Jr. et al.
patent: 4167601 (1979-09-01), Beckenbaugh et al.
patent: 4239813 (1980-12-01), Murakami
patent: 4287253 (1981-09-01), Leech
patent: 4546011 (1970-12-01), Knorre et al.
patent: 4564424 (1986-01-01), Cassat
patent: 4565606 (1986-01-01), Cassat
patent: 4639380 (1987-01-01), Amelio
patent: 4759952 (1988-07-01), Brasch
patent: 4791248 (1988-12-01), Oldenettel
patent: 4800461 (1989-01-01), Dixon
patent: 4913768 (1990-04-01), Wolf

Affiliated with

Also associated with

Rating

Printed circuits and base materials precatalyzed for metal depos does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuits and base materials precatalyzed for metal depos, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuits and base materials precatalyzed for metal depos will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-950522