Integrated circuit device having interchangeable terminal connec

Details Integrated circuit device having interchangeable terminal connec Integrated circuit device having interchangeable terminal connec

1996-03-05

1998-09-15

Voeltz, Emanuel Todd

Boots, shoes, and leggings

364491, 326 41, 257203, 257209, G05B 1905, H04Q 1100

Patent

active

058088970

ABSTRACT:
An integrated circuit package allows coupling of an integrated device within the package to the signal terminals of the package according to more than one connection pattern. The connection pattern is realized by coupling multiplexers between the integrated device and the signal terminals such that the pattern of coupling between the integrated device and the signal terminals can be controlled by a control signal. The control signal can be produced external to the package or within the package. In response to a control signal of the first state, the signal terminals are connected to the integrated device in a first pattern. In response to the control signal in the second state, the signal terminals are connected to the integrated device in a second pattern, different from the first pattern. In one embodiment, the first pattern and second pattern are mirror images to allow the packages to be mounted to opposite sides of a module while minimizing routing difficulties.

REFERENCES:
patent: 4431928 (1984-02-01), Skokan
patent: 5231588 (1993-07-01), Agrawal et al.
patent: 5621650 (1997-04-01), Agrawal et al.
Her et al. ("Over-the-cell routing with cell orientations", IEEE, 1994 IEEE International Symposium on Circuits and Systems, 30 May 1994, vol. 1, pp. 471-474).
Liang et al. ("High-performance VLSI through package-level interconnects", IEEE, 1989 Proceedings of 39th Electronic Components Conference, 22 May 1989, pp. 518-523).

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