Electronics circuit device and method of making the same

Electric heating – Metal heating – By arc

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Details

219121PD, 156646, 29576R, 29576B, 29576W, 29589, 29578, B23K 900

Patent

active

043563740

ABSTRACT:
Principal faces of semiconductor devices (19) are bonded by means of a bond layer (17) on one face (lower face) of a heat-resistive flexible synthetic resin film (8, 16), for example, polyimide film, the other face (upper face) of the heat-resistive flexible synthetic resin film (8, 16) has bonded wiring conductor films (22) of a specified wiring pattern, and specified parts of electrode metal layers (20) or specified regions (66, 67) on the principal face of the semiconductor devices (19) and specified parts of the wiring conductor films (22) on the resin film (8, 16) are connected by conductor films (22) formed extending between them through through-holes with sloped wall (18, 18a, 32) formed on the resin film (8, 16). Also, a thin reinforcing frame (24) of a metal film, formed on said one (lower) face of the resin film (8, 16) with a specified pattern, may be connected to the wiring conductor films (22) through other through-holes (181) with sloped wall.

REFERENCES:
patent: 3759767 (1973-09-01), Walls
patent: 4017886 (1977-04-01), Tomono et al.
patent: 4040891 (1977-08-01), Charg et al.
patent: 4141712 (1979-02-01), Rogers

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