Method of and apparatus for mounting electronic parts

Details Method of and apparatus for mounting electronic parts Method of and apparatus for mounting electronic parts

1997-09-26

2000-12-05

Young, Lee

Metal working

Method of mechanical manufacture

Electrical device making

29709, 29710, 29740, 29743, 29834, 36446815, 36446828, H05K 330, B23P 1900

Patent

active

061549576

ABSTRACT:
An electronic parts mounting method in which chips in a plurality of parts feeders are picked up respectively by at least three nozzles, and a lowered mounting efficiency is avoided when any of the nozzles becomes bad, thereby mounting the chips on a board with a good operation efficiency. In a normal condition, the chips in the parts feeders are simultaneously picked up respectively by the first, second and third nozzles, and are transferred to and mounted on the board. When any of the three nozzles becomes bad, the mounting of the chips by this bad nozzle is stopped while the mounting of the chips by the other normal nozzles is effected as scheduled in a program, and thereafter those chips scheduled to be mounted by the bad nozzle are mounted by the normal nozzles. Therefore, the number of the pick-up operations is reduced as much as possible, so that the mounting efficiency can be enhanced.

REFERENCES:
patent: 4593462 (1986-06-01), Yagi et al.
patent: 4858308 (1989-08-01), Komori
patent: 4980970 (1991-01-01), Uchida et al.
patent: 5088187 (1992-02-01), Takata et al.
patent: 5212881 (1993-05-01), Nishitsuka et al.
patent: 5377405 (1995-01-01), Sakurai et al.
patent: 5475619 (1995-12-01), Sugano et al.
patent: 5608642 (1997-03-01), Onodera
patent: 5761798 (1998-06-01), Suzuki
patent: 5794329 (1998-08-01), Rossmeisl et al.
patent: 5840594 (1998-11-01), Tsubouchi et al.
patent: 5864944 (1999-02-01), Kashiwagi et al.
patent: 5884831 (1999-03-01), Sato et al.
patent: 5911456 (1999-06-01), Tsubouchi et al.

Affiliated with

Also associated with

Rating

Method of and apparatus for mounting electronic parts does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of and apparatus for mounting electronic parts, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of and apparatus for mounting electronic parts will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-949430