Process for preparing silica sols

Compositions – Preservative agents – Anti-corrosion

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51308, B01J 1300, C01B 3314

Patent

active

043561071

ABSTRACT:
New and useful silica sols especially suitable for polishing semiconductor wafers are prepared by a special process involving heating a broad distribution aqueous silica sol containing larger silica particles of which at least 50% in number have a particle size of at least 40 millimicrons, the remainder of the silica particles being smaller and of different sizes, whereby the resultant silica sol contains a number of the larger silica particles having a particle size of at least 40 millimicrons which is at least as great as the starting sol, the weight average of said larger silica particles is greater than that of the larger silica particles in the starting sol, the number of smaller particles is less than the number of smaller particles in the starting sol, and the resultant sol contains fewer particles of different sizes than the starting sol.

REFERENCES:
patent: 2680721 (1954-06-01), Broge et al.
patent: 2956958 (1960-10-01), Iler
patent: 3538015 (1970-11-01), Mindick et al.
patent: 3901987 (1975-08-01), Payne et al.

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