Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1993-09-01
1994-08-16
Heinrich, Samuel M.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
2281246, 228193, B23K 100, B23K10136
Patent
active
053379390
ABSTRACT:
A method for soldering a ceramic body of an electric component, such as a microwave resonator, into a metal housing, includes applying a tin layer over the ceramic body provided with an electrically conductive layer. A high-melting-point lead-tin passivation layer is applied to a surface of the housing to be soldered to the ceramic body.
REFERENCES:
patent: 4168519 (1979-09-01), Hertz
patent: 4726507 (1988-02-01), Landram
patent: 5103135 (1992-04-01), Lange et al.
Heinrich Samuel M.
Siemens Matsushita Components GmbH & Co KG
LandOfFree
Method for soldering a ceramic body of an electrical component i does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for soldering a ceramic body of an electrical component i, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for soldering a ceramic body of an electrical component i will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-946103