Semiconductor integrated circuit device having mirror image circ

Details Semiconductor integrated circuit device having mirror image circ Semiconductor integrated circuit device having mirror image circ

1988-06-29

1991-05-07

Hille, Rolf

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 357 74, 357 75, 357 80, 174 524, 437220, H01L 2952

Patent

active

050141120

ABSTRACT:
A pair of like, semiconductor integrated circuit bars, such as DRAMS, have second level bonding pads formed over their active surfaces in mirror images of one another. The bars then become bonded to opposite sides of frame bonding pads of a lead frame to double the capacity of a normally encapsulated integrated circuit. The normal bar bonding pads of the circuit bars are arranged identical to one another, and a patterned and etched second level of metal forms second level lands over the bar bonding pads, the mirror image second level bonding pads and second level leads connecting corresponding second level lands to second level pads. A pair of 256K DRAMS can be connected either 256K.times.2 or 512K.times.1 by use of dummy second level pads for DATA-IN/OUT and ROW ADDRESS STROBE connection.

REFERENCES:
patent: 3955023 (1976-05-01), Blakely
patent: 3984860 (1976-10-01), Logue
patent: 4038488 (1977-07-01), Lin
patent: 4056681 (1977-11-01), Cook, Jr.
patent: 4195195 (1980-03-01), de Miranda et al.
patent: 4241360 (1980-12-01), Hambor et al.
patent: 4264917 (1981-04-01), Ugon
IBM Technical Disclosure Bulletin, vol. 27, No. 11, Apr. 1985, "Semiconductor Packaging Using Chip Mate Concept With Dual Inline Package (DIP) for Bonded Vias, Terminals and Reflowed Solder Pads and Using Chip Carrier for Reflowed Solder Pads and Bonded Terminals."

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