Chemistry: electrical and wave energy – Processes and products
Patent
1982-10-01
1984-04-17
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
204222, 204273, C25D 508, C25D 2120
Patent
active
044433042
ABSTRACT:
Disclosed is a plating module and method in a cell which has linearly spaced vertical anodes, and intermediately positioned spargers which can be angularly adjusted with their nozzles impinging directly or at an acute angle on the printed circuit boards positioned at a mid-point in each cell. The printed circuit boards are suspended in clamped relationship to a cathode bar. The cathode bar, in turn, in each unit is coupled to a reciprocating power drive so that the same will move back and forth an optimum distance of at least the spacing between an anode and a sparger, or more particularly, half the spacing between two spargers. The method of the invention contemplates positioning boards to be plated, whether with copper or tin, interiorly of the unit in which the boards are reciprocated in agitation relationship with a plating solution into which an anodes are positioned. The boards are then permitted to reciprocate for a given period of time with a preselected current density. Thereafter they are removed and cleansed, and subsequently positioned into another reciprocatory-type unit for further plating and concluding the cycle. Desirably vertically staggered turbulent free jets are employed angled to accomplish a maximized mass transfer of solution onto the printed circuit boards. In a given embodiment, flow rates can be between 100 and 300 gallons per minute, and current densities between 50 and 200 amperes per square foot.
REFERENCES:
patent: 1431022 (1922-10-01), Mumford
patent: 3271290 (1966-09-01), Ranowski
patent: 3796646 (1974-03-01), Zambon
patent: 4174261 (1979-11-01), Pellegrino
patent: 4372825 (1983-02-01), Eidschun
Dominik Jack E.
Micro-Plate Inc.
Tufariello T. M.
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