Lead saddle assembly and apparatus for forming

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

1562744, 1563082, 1563804, 1563805, 1563806, 1563808, 156475, 156521, 156522, 156567, 1565831, B29C 2704, B30B 1534

Patent

active

044432844

ABSTRACT:
A lead saddle assembly is disclosed which includes a plurality of insulated wire leads maintained in a spaced, side-by-side array. The assembly includes a lead saddle comprising first and second tape strips disposed on opposite sides of the array. The tape strips include heat-activatable adhesive so that during fabrication the application of heat to a pre-assembly of the wire leads and tape strips adhere the tape strip to each other and to the wire leads as the leads are held in their array. An apparatus and method for forming lead saddle assemblies as described are also disclosed.

REFERENCES:
patent: 2816596 (1957-12-01), Welch, Jr.
patent: 3006801 (1961-10-01), Pfeffer, Jr.
patent: 3421284 (1969-01-01), Zemek
patent: 3459878 (1969-08-01), Gressitt et al.
patent: 3707425 (1972-12-01), Jamal
patent: 4360400 (1982-11-01), Davis et al.

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