Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1997-09-30
2000-02-01
Ballato, Josie
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
438 14, H01L 2166
Patent
active
060207469
ABSTRACT:
A method and an apparatus for probing signals from an integrated circuit through the back side of an integrated circuit die. In one embodiment, a passive diffusion is disposed in a semiconductor substrate of a flip-chip mounted integrated circuit die. The passive diffusion is coupled to a signal line through a contact. The signal line carries the integrated circuit signal of interest. In one embodiment, the disclosed passive diffusion is oversized to reduce attenuation of a signal acquired from the passive diffusion. In addition, the disclosed passive diffusion is laterally spaced from nearby diffusions in the semiconductor substrate of the integrated circuit to enable exposure of the passive diffusion with a reduced risk of damaging nearby structures in the integrated circuit die, such as for example other diffusions, during the exposing process. Moreover, the disclosed passive diffusion is laterally spaced from nearby diffusions to reduce crosstalk interference from the nearby diffusions.
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Ballato Josie
Intel Corporation
Sundaram T. R.
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