Method for thermo-compression diffusion bonding a structured cop

Details Method for thermo-compression diffusion bonding a structured cop Method for thermo-compression diffusion bonding a structured cop

1980-11-28

1982-02-16

Weidenfeld, Gil

Metal fusion bonding

Process

Plural joints

29590, 228193, 357 81, B23K 2014, H01L 2158

Patent

active

043155910

ABSTRACT:
A method is provided for thermo-compression diffusion bonding respective structured copper strain buffers directly to each of the two major opposed surfaces of a substrateless semiconductor device wafer having a beveled outer edge surface. A selected portion of each strain buffer axially aligned with a like portion of the other strain buffer is diffusion bonded to the wafer while subjecting the wafer only to substantially compressive force so as to avoid wafer fracture. The lateral extent of each strain buffer is less than that of the respective wafer surface in contact therewith, allowing the beveled surface to be cleaned and passivated prior to attachment of the strain buffers to the wafer via diffusion bonding.

REFERENCES:
patent: 3295089 (1966-12-01), Moore
patent: 3657611 (1972-04-01), Yoneda
patent: 4067104 (1978-01-01), Tracy
patent: 4204628 (1980-05-01), Houston et al.
patent: 4257156 (1981-03-01), Houston

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