Method for making a flexible lead for a microelectronic device

Details Method for making a flexible lead for a microelectronic device Method for making a flexible lead for a microelectronic device

1995-06-18

1997-01-28

Valentine, Donald R.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205122, 205123, 216 14, 216 15, 216 20, C25D 502

Patent

active

055974708

ABSTRACT:
A method for providing a flexible lead for a microelectronic device. A lead such as nickel or a nickel alloy is provided in elongated strips on a base material such as copper, which in turn overlies a dielectric sheet. The base material is etched from beneath bond regions of the lead material strips and a cover layer of a bondable material such as gold selectively provided around the lead material strips. The lead material strips act as plating mandrels, and allow rapid deposition of the cover material. A detachment area may be provided in each lead so that the leads may be detached and displaced within a bonding window in the dielectric sheet for attachment to chip contacts.

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