Thin film semiconductor device with oxide film on insulating lay

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 237, 357 59, 357 2, 350338, 350336, 350339R, 350342, H01L 3300

Patent

active

049840339

ABSTRACT:
A thin film semiconductor device is formed by preparing a substrate, forming a pattern of metal thin film on the substrate, forming an insulating layer on the metal thin film, and forming a pattern of a semiconductor thin film active layer over the pattern of the metal thin film by laser CVD.

REFERENCES:
patent: 4409605 (1983-10-01), Ovshinsky et al.
patent: 4636038 (1987-01-01), Kitahara et al.
patent: 4737712 (1988-11-01), Ukai et al.
patent: 4810060 (1989-03-01), Ukai
patent: 4834507 (1989-05-01), Kato et al.
patent: 4885616 (1989-12-01), Ohta
Ishizu et al., "Direct Pattern Writing of Silicon by Argon Laser Induced CVD", Proceedings of Symposium on Dry Process, (Oct. 24-25, 1985), Tokyo, pp. 13-18.
Baverle et al., "Ar.sup.+ Laser Induced Chemical Vapor Deposition of Si from SiH.sub.4 ", Applied Physics Letters, 40(9), May 1, 1982, pp. 819-821.
Coblenz, "Semiconductor Compounds", Electronic Buyers' Guide, Jun. 1958-Mid-Month, pp. R4-R5.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thin film semiconductor device with oxide film on insulating lay does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film semiconductor device with oxide film on insulating lay, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film semiconductor device with oxide film on insulating lay will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-938552

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.