Progressive form die

Metal deforming – By plural tool-couples

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Details

72414, 72381, 72307, 72323, 140105, 29882, H01R 4300, B21F 100

Patent

active

050126644

ABSTRACT:
An apparatus, and method of using the apparatus for forming multiple bends in the lead wires of a multiple lead integrated circuit package. The apparatus comprises cooperating first form punches which provide a first bend in the lead wires, and a plurality of second form punches and anvils to provide a second bend in the lead wires. The lead wires are held by a clamp mechanism during the bending process so as to prevent damage to the package. The integrated circuit package is provided in a lead frame strip which is indexed through the apparatus so that a plurality of packages are worked at each of the three different positions. A misfeed mechanism is provided to shut down power to the device in the event of a misfeed.

REFERENCES:
patent: 2834393 (1958-05-01), Cihlar
patent: 3117472 (1964-01-01), Mingus
patent: 3177692 (1965-04-01), Stephens
patent: 3416348 (1968-12-01), Carter
patent: 3788118 (1974-01-01), Joseph
patent: 4027521 (1977-06-01), McKee
patent: 4205548 (1980-06-01), Bothner
patent: 4553420 (1985-11-01), Fierkens
Hastede, R. G., et al., "Core Plane Terminal Forming Die" from IBM Technical Disclosure Bulletin, vol. 8, No. 9, Feb. 1966, pp. 1208, 1209.

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