Method for developing a pattern on a ceramic substrate

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427108, 4271262, 427264, 427266, B05D 512

Patent

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042948673

ABSTRACT:
A method for developing a pattern of electrically conductive material on a ceramic substrate is disclosed. The method includes the steps of depositing on the ceramic substrate in a desired pattern a thin layer of a heat fusible material which contains a granular current conducting base metal. An encasing layer is deposited over the pattern formed of the heat fusible material. The encasing layer is formed from an oxygen barrier material containing an oxygen getting material. This encasing layer is non-heat fusible and nonreactive with the heat fusible material. All of this structure is heated in an oxygen containing ambient to a temperature sufficient to permit the heat fusible material to fuse to the ceramic substrate. The oxygen barrier material protects the granular, current conducting base metal of the fusible material from oxidation by physically blocking out oxygen and by chemically providing an oxygen getting material which will react with any oxygen which does manage to penetrate into the oxygen barrier material. The ceramic substrate, fused heat fusible material, and remaining oxygen barrier material thereon are cooled back to room temperature and any remaining oxygen barrier material is removed from the ceramic substrate.

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