Method for making eutectic charge-coupled devices

Metal working – Method of mechanical manufacture – Assembling or joining

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29579, 29576B, 148 15, 148174, 428611, 357 24, H01L 2710

Patent

active

044610700

ABSTRACT:
A method is described for the fabrication of charge-coupled devices by the formation of a thin film lamellar metallic eutectic and subsequent selective removal of one of the eutectic phases to form one of the spaced gate arrays of such devices.

REFERENCES:
patent: 2983633 (1961-05-01), Bernardi et al.
patent: 3387360 (1968-06-01), Nakamura et al.
patent: 3671102 (1972-06-01), Clawson et al.
patent: 4290187 (1981-09-01), Stein
Cline, "Directionally Solidified Thin-Film Eutectic Alloys", J. Appl. Phys., 52(1), Jan. 1981, pp. 256-260.

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