Apparatus for simultaneously encapsulating a plurality of electr

Details Apparatus for simultaneously encapsulating a plurality of electr Apparatus for simultaneously encapsulating a plurality of electr

1986-05-14

1988-06-21

Hoag, Willard E.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

425117, 4251291, 425129R, 425145, 425150, 425548, 425588, B29C 4502, B29C 4514

Patent

active

047521988

ABSTRACT:
An apparatus is disclosed for encapsulating a plurality of electronic components, which are bonded to the conductors of a strip, within a mold. The apparatus has an injection unit made up of a plurality of plungers slidable in a carrier and controlled by hydraulic cylinders. The hydraulic cylinders apply pressure to the plungers, which have a heating element for heating the material to be injected. A sensor attached to each plunger senses when the material is sufficiently softened, at which point a driving mechanism drives the entire carrier toward the mold, causing the plungers to inject the material into the mold.

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patent: 4615849 (1986-10-01), Hahn
Patent Abstracts of Japan, vol. 9, No. 159 (Jul. 4, 1985).

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