Process for electroless copper deposition from an acidic bath

Details Process for electroless copper deposition from an acidic bath Process for electroless copper deposition from an acidic bath

1977-07-13

1979-03-06

Smith, John D.

Coating processes

With post-treatment of coating or coating material

Coating material recirculation or regeneration

106 123, 106 126, 427 98, 427305, 427306, 427430A, C23C 302

Patent

active

041431863

ABSTRACT:
An electroless plating process for copper in an acidic bath whereby copper by a chemical reduction process is continuously being plated to a desired thickness on a suitable substrate; this process is especially applicable to plating of copper and substrates which are susceptible to alkaline solutions such as polyimides, polyparabanic acids, etc.

REFERENCES:
patent: 3431120 (1969-04-01), Weisenberger
patent: 3615733 (1971-10-01), Shipley et al.
patent: 3736170 (1973-05-01), Lo
patent: 3791848 (1973-06-01), De Angelo
Pearlstein et al., Plating, vol. 60, pp. 474 to 476 (1973).
Modern Electroplating, John Wiley & Sons, pp. 734, 735 c 1974.
Brenner, "Electroless Plating Comes of Age" Metal Finishing, Nov., 1954.

Affiliated with

Also associated with

Rating

Process for electroless copper deposition from an acidic bath does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for electroless copper deposition from an acidic bath, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for electroless copper deposition from an acidic bath will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-921925