Process for producing multilayer wiring structure

Details Process for producing multilayer wiring structure Process for producing multilayer wiring structure

1990-10-04

1992-11-24

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4274071, C23C 2600

Patent

active

051659573

ABSTRACT:
A multilayer wiring structure produced by using a special poly(amic acid) ester oligomer for making an interlayer insulating film has an almost flattened surface without suffering from level differences of underlying wiring patterns.

REFERENCES:
patent: 3037966 (1962-06-01), Chow
patent: 4030948 (1977-06-01), Berger
patent: 4347306 (1982-08-01), Takeda
patent: 4528216 (1985-07-01), Ogura
patent: 4568601 (1986-02-01), Araps
patent: 4586997 (1986-05-01), Lee
patent: 4603195 (1986-07-01), Babich
patent: 4618878 (1986-10-01), Aoyama
patent: 4654223 (1987-03-01), Araps
patent: 4656050 (1987-04-01), Araps
patent: 4699803 (1987-10-01), Araps
patent: 4705720 (1987-11-01), Kundinger
patent: 4871619 (1989-10-01), Araps
R. Cannizzaro "Applications of Polyimide Materials in Electronic Circuitry" Solid State Technology, Nov., 1969, pp. 31-38.

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