Socket for integrated circuit component

Details Socket for integrated circuit component Socket for integrated circuit component

1985-10-31

1988-01-12

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

H01R 2372

Patent

active

047188553

ABSTRACT:
Sockets specifically adapted for burn-in testing of small outline integrated circuit components are disclosed. The multicontact sockets have terminals located in cavities oriented to receive the small outline integrated circuit leads. The terminals are located between adjacent leads and are positioned to resiliently engage the interstitial edges of the package leads, thus imparting minimal stress normal to the plane of the leads. Both surface mount and through-hole sockets are disclosed and the terminals as depicted can have a bowed leaf spring configuration or a preloaded flat terminal, arcuately deformed for retention within the housing cavities. Thus the small outline integrated circuit components can be routinely inserted into the sockets for test purposes. The sockets can also be used in a conventional manner to socket integrated circuit components such as SOICs on a printed circuit board.

REFERENCES:
patent: 3212047 (1965-10-01), McDonough
patent: 3391383 (1968-07-01), Antes
patent: 3737838 (1973-06-01), Mattingly, Jr. et al.
patent: 4033656 (1977-07-01), Freehauf et al.
patent: 4420205 (1983-12-01), Kirkman
patent: 4560218 (1985-12-01), Billman et al.
IBM Bulletin, McConnell, vol. 3, No. 12, p. 11, 5-1961.

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