Method of coating ridged plates, particularly printed circuit bo

Details Method of coating ridged plates, particularly printed circuit bo Method of coating ridged plates, particularly printed circuit bo

1993-04-01

1994-12-27

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427428, C23C 2600

Patent

active

053764048

ABSTRACT:
Method for applying liquid varnish coating over raised conductor pattern of a printed circuit board. The circuit board is passed through nip rolls at least one of which has a coating of liquid varnish thereon. The thickness of the coating on the nip roll is adjusted to between 5 and 100 .mu.m by adjusting the thickness of liquid varnish on an applicator roll in contact with the nip roll. The flow of liquid varnish applied to the applicator roll is at least 1.5 times the rate of transfer from the nip rolls to the circuit board.

REFERENCES:
patent: 3535157 (1970-10-01), Steinhoff
patent: 4493857 (1985-01-01), Knigge
patent: 5112428 (1992-05-01), Correa
Werner Peters, "Fostosensitive Lotstopplacke und ihre Applikationsverfahren", Oct. 1988, Speziallacke fur die Elektronik.

Affiliated with

Also associated with

Rating

Method of coating ridged plates, particularly printed circuit bo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of coating ridged plates, particularly printed circuit bo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of coating ridged plates, particularly printed circuit bo will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-917627