Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-10-20
1994-12-27
Beck, Shrive
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
427 96, 4272071, 4274301, 156 60, C09J 500, B05D 100
Patent
active
053762096
ABSTRACT:
An assembly of an article and a polyimide composition is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A polyamic acid solution which yields a polyimide having a low coefficient of thermal expansion (CTE) was prepared. Equimolar quantities of an aromatic diamine and an aromatic dianhydride were reacted in a solvent medium to form a polyamic acid solution. A metal ion-containing additive was added to the solution. Examples of this additive are: TbCl.sub.3, DyCl.sub.3, ErCl.sub.3, TmCl.sub.3, Al(C.sub.5 H.sub.7 O.sub.2).sub.3, and Er.sub.2 S.sub.3. The polyamic acid solution was imidized and is combined with the article to form the assembly.
REFERENCES:
patent: 4284461 (1981-08-01), St. Clair
patent: 4311615 (1982-01-01), Taylor
patent: 4576857 (1986-03-01), Gannett
patent: 4609565 (1986-09-01), Yates
patent: 4670325 (1987-06-01), Bakos
patent: 4839232 (1989-06-01), Morita
patent: 4842948 (1989-06-01), Gagliani
patent: 5112462 (1992-05-01), Swisher
patent: 5167985 (1992-12-01), Ito
patent: 5248519 (1993-09-01), Stoakley
St. Clair et al "Electrically-Conductive Palladium-Containing Polyimide Films" NASA Tech Briefs, Fall, 1980 p. 325.
Kirk-Othemer "Encyclopedia of Chemical Technology" vol. 18 John Wiley & Sons, 1982 pp. 706, 707, 711.
St. Clair Anne K.
Stoakley Diane M.
Beck Shrive
Bryant Joy L.
Dang Vi Duong
Helfrich George F.
The United States of America as represented by the Administrator
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