Ink jet head manufacturing method

Details Ink jet head manufacturing method Ink jet head manufacturing method

1993-08-23

1994-12-27

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156249, 156321, B32B 3100, C09J 506

Patent

active

053762045

ABSTRACT:
In an ink jet head manufacturing method, a head substrate is heated, and then an adhesive sheet having an adhesive layer is placed on the head substrate so as to bring the adhesive layer in contact with one surface of the substrate so that the adhesive layer only at portions in contact with the substrate is softened by the temperature of the substrate and is transferred to the substrate as the adhesive sheet is peeled off the substrate. Then a nozzle plate is placed on the head substrate in such a manner that small holes of the nozzle plate are aligned with ink ejection openings of the substrate, whereupon the nozzle plate is reheated under pressure so as to be attached to the substrate. Since the adhesive layer is transferred to the substrate, it is possible to effectively prevent the adhesive agent from protruding into the openings and hence to improve the nozzle density. It is also not necessary to previously provide the adhesive sheet with any holes.

REFERENCES:
patent: 4225379 (1980-09-01), Ishii et al.
patent: 4229751 (1980-10-01), Tamai
patent: 4334234 (1982-06-01), Shirato et al.
patent: 4678529 (1987-07-01), Drake et al.
patent: 5148193 (1992-09-01), Inamoto et al.

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