Semiconductor device having a heat sink with bumpers for protect

Details Semiconductor device having a heat sink with bumpers for protect Semiconductor device having a heat sink with bumpers for protect

1995-10-25

1998-09-15

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257723, 257720, 257717, 257706, 257707, 257675, 438124, 438123, 438122, 438121, H01L 2336, H01L 2350, H01L 2334

Patent

active

058083596

ABSTRACT:
A QFP adapted to lowering the heat resistance and increasing the number of pins includes a heat-radiating metal plate having bumpers formed at the four corners thereof as a unitary structure, a semiconductor chip mounted on the heat-radiating metal plate, leads provided on the heat-radiating metal plate and surrounding the peripheries of the semiconductor chip, bonding wires for connecting the leads to the semiconductor chip, and a sealing resin member for sealing part of the semiconductor chip, inner leads of the leads, bonding wires and part of the heat-radiating metal plate. The tips of the bumpers integrally formed with the heat-radiating metal plate are positioned outside the tips of the outer leads that are protruding from the sealing resin member. In the QFP producing method, the heat-radiating metal plate having the bumpers and the lead frame having the leads are secured outside the sealing resin member.

REFERENCES:
patent: 4399610 (1983-08-01), Moyer
patent: 4819041 (1989-04-01), Redmond
patent: 5036381 (1991-07-01), Lin
patent: 5114880 (1992-05-01), Lin
patent: 5138430 (1992-08-01), Gow, 3rd et al.
patent: 5216283 (1993-06-01), Lin
patent: 5258649 (1993-11-01), Tanaka et al.
patent: 5318451 (1994-06-01), DelPrete et al.
patent: 5345106 (1994-09-01), Doering et al.
patent: 5350713 (1994-09-01), Liang
patent: 5402006 (1995-03-01), O'Donley

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