Semiconductor device having resin encapsulated package structure

Details Semiconductor device having resin encapsulated package structure Semiconductor device having resin encapsulated package structure

1995-06-07

1998-09-15

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257664, 257678, 257694, 257697, 257691, H01L 2348

Patent

active

058083570

ABSTRACT:
A semiconductor device includes a substrate having a first surface, a second surface and at least one conductor parts which are exposed at both the first and second surfaces of the substrate, a semiconductor chip provided on the first surface of the substrate and having a plurality of electrode pads, a plurality of leads, a plurality of bonding-wires electrically connecting the leads and the conductor parts to corresponding ones of the electrode ads of the semiconductor chip, and a resin package encapsulating the semiconductor chip, part of the leads, and the substrate so that the conductor parts are exposed at the second surface of the substrate.

REFERENCES:
patent: 4742385 (1988-05-01), Kohmoto
patent: 5097319 (1992-03-01), Satriano
patent: 5162896 (1992-11-01), Takubo et al.
patent: 5225709 (1993-07-01), Nishiuma et al.
patent: 5250841 (1993-10-01), Sloan et al.
IBM Technical Disclosure Bulletin; vol. 33, No. 2, Jul. 1990.

Affiliated with

Also associated with

Rating

Semiconductor device having resin encapsulated package structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having resin encapsulated package structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having resin encapsulated package structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-91441