Lead frame of a semiconductor device and a method for designing

Details Lead frame of a semiconductor device and a method for designing Lead frame of a semiconductor device and a method for designing

1996-06-04

1998-09-15

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257669, 257670, H01L 23495

Patent

active

058083553

ABSTRACT:
The present invention relates generally to a lead frame which is bended with a predetermined angle many times in order that a sectional area of a punch to form two lead lines which are located in the center of tie bars is increased, and increase the inertial moment as to a sectional area in making a lead frame of a desired shape. And the above-mentioned lead frame comprises a dambar; inner leads which has a certain angle at the part being below half the distance from lead tips to the above-mentioned dambar, and is connected to the above-mentioned dambar; outer leads which is connected to the above-mentioned dambar, and is populated on a circuit board; and tie bars which support the above-mentioned inner leads in case of taping.

REFERENCES:
patent: 5457341 (1995-10-01), West

Affiliated with

Also associated with

Rating

Lead frame of a semiconductor device and a method for designing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame of a semiconductor device and a method for designing , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame of a semiconductor device and a method for designing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-91425